GD100 Thermal Paste is using organic silicone as the main raw material, add heat resistance andexcellent heat conduction performance materials as thermal conductive filler,made into thermal conductive filling gap paste. It is a pre cured colloid, don't need to prevent curing after assembly,save time, improve production efficiency .

Features:

1.Supersoft : <10 degrees,

2.Highthermal conductivity,

3.Highand low temperature resistance

4.Without curing, convenient operation, high efficiency,

5.Excellentinsulating performance, aging resistance, long storage life,

Application:

1.Converterand rectifier;

2.Energyconversion device;

3.Integratedcircuit, CPU memory module;

4.Electronicand electrical heating spare parts;

5.LED lamp, power supply, UPS power supply etc.;