Product Name : JRF-PM460 Silicone Gap Pad

JRF-PM460 is use of silicone material thermal conductive, good insulation performance, soft and elastic characteristics, placed between the power heating device and heat dissipating structure, the power module generates heat effectively transmit to the radiating component.

Performance and characteristics:

1.High thermal conductivity, heat transfer coefficient 4.6W/m-k

2.Stable performance , low thermal resistance, effectively improve the heat transfer speed

3.Low hardness , its viscosity high, easy to use adhesive

4.By UL and V-O certification standards

Applications:

1. Car engine module and vehicle electronic equipment

2. Notebook computer, table computer CPU

3. Flat panel TV, mobile equipment, high-speed hard disk driver

4. Semiconductor and the radiating fin between

5. Computer, PC server, workstation6. LED lighting device and mass storage device